GOLD BOND ENGINEERING MATERIALS LIMITED
(Company Registration No. 1063221)

GOLD BOND ENGINEERING MATERIALS LIMITED was established on 29-Jul-2006, CR No. is: 1063221, The company is Dissolved now, The company belongs to Company. As so far this company has running for17years 10months.

Company Name:
GOLD BOND ENGINEERING MATERIALS LIMITED
Chinese Company Name::
金邦工程物料有限公司
Company Registration No.:
1063221
Date of Incorporation:
2006-07-29
Company Type:
Private company limited by shares
Company Status::
Dissolved
Date of Dissolution:
2017-06-23
Date of Annual Examination::
Jul 29 - Sep 09
Remarks:
Dissolved by Deregistration
Register of Charges::
Unavailable
Name History:
29-JUL-2006
GOLD BOND ENGINEERING MATERIALS LIMITED
金邦工程物料有限公司
Updated on
2019-07-01
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