TOP BOND TECHNOLOGY LIMITED
(Company Registration No. 0934308)
TOP BOND TECHNOLOGY LIMITED was established on 17-Nov-2004, CR No. is: 0934308, The company is Dissolved now, The company belongs to Company. As so far this company has running for20years 5months 3weeks 1days .
TOP BOND TECHNOLOGY LIMITED
駿邦科技有限公司
HILL TOP PREPRESS TECHNOLOGY LIMITED
HILL TOP PREPRESS TECHNOLOGY LIMITED was incorporated on 1988-01-29.
TOP BOND INVESTMENTS LIMITED
TOP BOND INVESTMENTS LIMITED was incorporated on 1988-07-29.
TOP RAY TECHNOLOGY LIMITED
TOP RAY TECHNOLOGY LIMITED was incorporated on 1989-03-31.
TOP LEAP TECHNOLOGY LIMITED
TOP LEAP TECHNOLOGY LIMITED was incorporated on 1989-07-28.
TOP SKILL TECHNOLOGY LIMITED
TOP SKILL TECHNOLOGY LIMITED was incorporated on 1991-01-04.
TRIPLE BOND TECHNOLOGY LIMITED
TRIPLE BOND TECHNOLOGY LIMITED was incorporated on 1991-01-29.
JADE BOND TECHNOLOGY LIMITED
JADE BOND TECHNOLOGY LIMITED was incorporated on 1991-03-14.
LINK BOND TECHNOLOGY LIMITED
LINK BOND TECHNOLOGY LIMITED was incorporated on 1991-07-04.
TOP LEADER TECHNOLOGY LIMITED
TOP LEADER TECHNOLOGY LIMITED was incorporated on 1992-10-13.
- top bond technology limited
- hongkong hard-tech electron co., limited
- hongkong topheng limited
- pacific make limited
- rich song investments limited
- jingxin (hongkong) jewelry intl limited
- tin yau first development limited
- united medicine group (asia) limited
- rolling wheels motors limited
- v&p global trade corp limited
- dws technology limited
- w & g (h.k.) limited
- suzie's cultural company limited
- babies b1 limited
- inter-continental trade limited
2004-11-17